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Sapphire 11323-01-40G Nitro+ AMD Radeon RX 7900 XT Vapor-X with 20GB GDDR6 Gaming Graphics Card - Image 1

Sapphire 11323-01-40G Nitro+ AMD Radeon RX 7900 XT Vapor-X with 20GB GDDR6 Gaming Graphics Card - Image 2

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Sapphire 11323-01-40G Nitro+ AMD Radeon RX 7900 XT Vapor-X with 20GB GDDR6 Gaming Graphics Card

Name: Sapphire 11323-01-40G Nitro+ AMD Radeon RX 7900 XT Vapor-X with 20GB GDDR6 Gaming Graphics Card
Brand: SAPPHIRE Technology
SKU: 11323-01-40G
Availability: OutOfStock

SAPPHIRE Technology

Authorized Retailer

SKU: 11323-01-40G

Original price was: ₨254,000.Current price is: ₨249,400.

Out of stock

Software BIOS Switch

Switch from OC BIOS to Secondary mode or back using our TriXX software for a quick and easy switch between your dual BIOS modes.

Vapor-X Cooling

The Vapor Chamber is mounted in contact with the surface of the main chip and memory. Since the entire area transfers heat at the same rate, the Vapor-X module has been engineered to operate more efficiently than a copper heat sink at carrying away heat. Upon gaining heat, the heat source is pushed to the Vaporization Wicks to begin the heat dissipation process. Due to extreme low pressure, working fluid and pure water are easily vaporized, and transferred through the vacuum until reaching the Condensing Wick which is adjacent to the cooled surface. From here, it turns back to a liquid state whereby the liquid is then absorbed into the Transportation Wick by capillary action and moved back towards the Vaporization Wick. A recycled liquid system occurs when the heat source reheats the liquid and it becomes re-vaporized by the Vaporization Wick to restart the Vapor-X Cooling process.

WAVE Fin Design & V-Shape Fin Design for GPU cooling

The WAVE Fin Design reduces friction when the wind goes into the fin module resulting in a reduction of the wind cut noise. The V-shape fin design on top of the GPU accelerates and centralizes the air flow around the GPU to dissipate heat efficiently.

Die Casted Aluminum-Magnesium Alloy Frame & Frontplate Heatsink

The Die Casted Aluminum-Magnesium Alloy Frame enveloping the sides of the PCB help to strengthen the structural stiffness of the shroud to create a strong, scratch resistant and high quality finish that elevates the aesthetic and strength of the graphics card. Overlaying the entire PCB, the die casted Frontplate Heatsink cools the VRM, Memory and Chokes resulting in superior heat dissipation for top-notch airflow and cooling performance.

Digital Power Design

SAPPHIRE NITRO+ & PULSE AMD Radeon RX 7900 Series are designed with digital power which provides accurate power control and excellent power efficiency.

Assistive System Fan Control

When the temperature of the GPU increases, the graphics card fans speed up accordingly. To further help with cooling and heat dissipation, the Assistive System Fan Control feature in SAPPHIRE’s TriXX software controls the speed of a system fan to automatically increase at the same time as the graphics card fans, this assists in expelling the heated air from the entire system faster.